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Flexible printed circuit boards


Flexible printed circuit boards are flexible foils on Polyimide or Polyester.

Pioneering solutions are opened up here since the quality of Flex materials are also suitable for chip and flip chip assembly.

Mainly one-sided, two-sided and 4-layer flex structures are preferred.

The advantages of flexible printed circuit boards:

  • High dynamic and mechanical strength
  • Compact and complex structures in the smallest space
  • Saving the use of connectors
  • Less volume and weight
  • 3D mountable

As a base foil for flexible printed circuit boards MECO Elektoniks uses primarily Polyimide.

For unilateral applications polyester can be used as an alternative.


Depending on the product-related requirements, the use of different materials is possible. For this reason it is extremely important, even at the layout design stage to contact our company so that we can work out the optimal solution for your requirements together.


Flexible base material

As a base foil for flexible circuit boards MECO primarily uses a Polyimide , because of it’s high heat resistance, and also for it’s perfect solderability.

Implementation Specifications
Polyimide density 25 µ, 50 µ, 75 µ
Copper 12 µ ,18 µ, 35 µ, 70 µ Single or double sided
Rolled copper ( RA ) Suitable for dynamic flex applications
Electrolytically deposited copper ( ED ) Reduced elongation at break , suitable for static applications
Adhesive Systems acrylic adhesive suitable for dynamic flex applications
Epoxy Resin reduced dynamic flexibility
Glueless MECO standard, high flexibility, chemical resistance
Protective coatings Process Specifications
Polyimid Coverlay Polyimide density 25 or 50 μ pressing method. e.g.openings
Acrylic – or Epoxy 25 or 50 μ must be structured mechanically or by laser
Flexible Solder Mask NPR-80 screen printing method

Since Polyimide foils tend to have high moisture absorption, the circuit boards must be tempered before the assembly process.